Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor package including redistribution pattern

Semiconductor package including redistribution pattern

US Patent 12388000 · Granted Aug 12, 2025

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Fan-out semiconductor package2025
Mobile terminal and display system2025
Electronic device having flexible display with variable size and reference posit2025
Electronic device including flexible display and method for operating the same2025
Terminal and system for facilitating Bluetooth connections2025
Package substrate and semiconductor package including the same2024
Electronic device including display having plurality of states and method for co2024
Display device and display system2024
Semiconductor package2024
Semiconductor package2024
Package substrate including a redistribution pad extending from a redistribution2023
Package substrate including segment grooves arranged in a radial direction of a 2022