Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Power-module substrate with heat-sink

Power-module substrate with heat-sink

US Patent 11302602 · Granted Apr 12, 2022

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method for manufacturing bonded body and method for manufacturing insulation cir2025
Method of manufacturing bonded body for insulation circuit substrate board and b2024
Manufacturing method of electronic-component-mounted module2022
Power-module substrate with heat-sink2022
Power-module substrate with heat-sink2022
Heat sink-attached power module substrate board and power module2022
Insulation circuit board with heat sink2022
Electronic-component-mounted module design to reduce linear expansion coefficien2022
Insulation circuit board with heat sink2022
Method of manufacturing bonded body for insulation circuit substrate board and b2022
Insulated circuit board2021
Joined body manufacturing method, multilayer joined body manufacturing method, p2020