Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Joined body manufacturing method, multilayer joined body manufacturing method, power-module substrate manufacturing method, heat sink equipped power-module substrate manufacturing method, and laminated body manufacturing device

Joined body manufacturing method, multilayer joined body manufacturing method, power-module substrate manufacturing method, heat sink equipped power-module substrate manufacturing method, and laminated body manufacturing device

US Patent 10607915 · Granted Mar 31, 2020

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method of manufacturing bonded body for insulation circuit substrate board and b2024
Method for producing insulating circuit substrate with heat sink2023
Method of manufacturing power module substrate board and ceramic-copper bonded b2023
Manufacturing method of electronic-component-mounted module2022
Manufacturing method of electronic-component-mounted module2022
Power-module substrate with heat-sink2022
Heat sink-attached power module substrate board and power module2022
Heat sink-attached power module substrate board and power module2022
Insulation circuit board with heat sink2022
Electronic-component-mounted module design to reduce linear expansion coefficien2022
Electronic-component-mounted module design to reduce linear expansion coefficien2022
Power-module substrate with heat-sink2022