Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Topside-cooled semiconductor package with molded standoff

Topside-cooled semiconductor package with molded standoff

US Patent 11239127 · Granted Feb 1, 2022

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Switchable NMOS-CMOS voltage-controlled oscillator (VCO) with shared inductor-ca2025
Power electronic assembly having a laminate inlay and method of producing the po2024
Semiconductor device having a contact clip with a contact region having a convex2024
Power electronic assembly and method of producing thereof2023
Power semiconductor package and method for fabricating a power semiconductor pac2021
Interconnect clip with angled contact surface and raised bridge2021
Power transistor device including first and second transistor cells having diffe2021
Semiconductor device and method for fabricating a semiconductor device2021
Encapsulated leadless package having an at least partially exposed interior side2021
Semiconductor chip package having a cooling surface and method of manufacturing 2020
Transistor package with three-terminal clip2019
Multi-functional interconnect module and carrier with multi-functional interconn2019