Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Apparatuses including redistribution layers and related microelectronic devices

Apparatuses including redistribution layers and related microelectronic devices

US Patent 11211351 · Granted Dec 28, 2021

Estimated economic value: $20,140,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor device having bonding structure and method of manufacturing the sa2025
Conductive structure and capacitor structure and method for manufacturing the sa2025
Semiconductor device and method of manufacturing the same2025
Semiconductor structure having hybrid bonding pad2025
Method of manufacturing tsemiconductor device having bonding structure2025
Manufacturing method of semiconductor device2025
Method of manufacturing semiconductor structure having hybrid bonding pad2025
Method for manufacturing semiconductor structure with single side capacitor2024
Semiconductor structure with single side capacitor2024
Semiconductor device and method of manufacturing the same2024
Semiconductor device and method of manufacturing the same2023
Method for manufacturing semiconductor structure2023