Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Molded die last chip combination

Molded die last chip combination

US Patent 11211332 · Granted Dec 28, 2021

Estimated economic value: $188,037,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Systems and methods for automatic clustering and canonical designation of relate2025
Semiconductor chip device2025
Methods and systems for controlling a left ventricular assist device2025
Molded semiconductor chip package with stair-step molding layer2025
Molded semiconductor chip package with stair-step molding layer2025
Semiconductor chip device integrating thermal pipes in three-dimensional packagi2025
Stacking power delivery device dies2025
Systems and methods for media streaming application interacting with a social ne2025
Fanout module integrating a photonic integrated circuit2025
Arrangement and thermal management of 3D stacked dies2025
Mixed density interconnect architectures using hybrid fan-out2025
Molded chip package with anchor structures2025