Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › In-situ full wafer metrology system

In-situ full wafer metrology system

US Patent 11204312 · Granted Dec 21, 2021

Estimated economic value: $167,553,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

In-situ reflectometry for real-time process control2025
Instrument for medical diagnosis2025
System and method to map thickness variations of substrates in manufacturing sys2025
Autonomous substrate processing system2025
In-line monitoring of OLED layer thickness and dopant concentration2025
Spatial pattern loading measurement with imaging metrology2025
Systems and methods for integrating load locks into a factory interface footprin2024
Systems and methods for integrating load locks into a factory interface footprin2024
Factory interface robots usable with integrated load locks2024
Factory interface robots usable with integrated load locks2024
Surface roughness and emissivity determination2024
Optical metrology models for in-line film thickness measurements2024