Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › System and method for electrostatically chucking a substrate to a carrier

System and method for electrostatically chucking a substrate to a carrier

US Patent 11196360 · Granted Dec 7, 2021

Estimated economic value: $82,478,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Methods for forming films on substrates2025
Apparatus and method for controlling a flow process material to a deposition cha2025
Equipment front end modules with induced gas mixing, and methods of use thereof2025
Substrate measurement subsystem2025
Method for non-contact low substrate temperature measurement2025
Integrated substrate measurement system to improve manufacturing process perform2025
Filter isolation for equipment front end module2024
Quartz susceptor for accurate non-contact temperature measurement2024
Methods of using a segmented showerhead for uniform delivery of multiple pre-cur2024
Showerhead for providing multiple materials to a process chamber2024
Segmented showerhead for uniform delivery of multiple precursors2023
Carrier FOUP and a method of placing a carrier2023