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Home › Fabrication method of high aspect ratio solder bumping with stud bump and injection molded solder, and flip chip joining with the solder bump

Fabrication method of high aspect ratio solder bumping with stud bump and injection molded solder, and flip chip joining with the solder bump

US Patent 11181704 · Granted Nov 23, 2021

Estimated economic value: $2,653,000 ⓘ

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