{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Semiconductor device packages with electrical routing improvements and related methods", "item": "https://www.patentleaderboard.com/patent/11145574"}]}
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Home › Semiconductor device packages with electrical routing improvements and related methods

Semiconductor device packages with electrical routing improvements and related methods

US Patent 11145574 · Granted Oct 12, 2021

Estimated economic value: $129,574,000 ⓘ

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