Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Hole connecting layer manufacturing method, circuit board manufacturing method and circuit board

Hole connecting layer manufacturing method, circuit board manufacturing method and circuit board

US Patent 11083091 · Granted Aug 3, 2021

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

High-speed printed circuit board and differential wiring method thereof2019
Drilling method for PCBs with high hole position precision2018
Preparation method of a boss-type metal-based sandwich rigid-flex circuit board2018
Rigid-flexible circuit board having flying-tail structure and method for manufac2017
Method, server, client, and system for releasing instant messaging key-value dat2017