Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11083091 | Hole connecting layer manufacturing method, circuit board manufacturing method and circuit board | Zeyang Lian, Sen Wu, Bei Chen | 2021-08-03 |
| 9641468 | Method, server, client, and system for releasing instant messaging key-value data | Nianbo Liao, Guolin Chen, Xing Shu | 2017-05-02 |