SW

Sen Wu

GC Guangzhou Fastprint Circuit Tech Co.: 1 patents #2 of 21Top 10%
SC Shenzhen Fastprint Circuit Tech Co.: 1 patents #2 of 21Top 10%
YC Yixing Silicon Valley Electronics Tech Co.: 1 patents #2 of 13Top 20%
Overall (All Time): #2,742,073 of 4,157,543Top 70%
1
Patents All Time

Issued Patents All Time

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11083091 Hole connecting layer manufacturing method, circuit board manufacturing method and circuit board Zeyang Lian, Yanguo Li, Bei Chen 2021-08-03