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Home › Hybrid sidewall barrier facilitating low resistance interconnection

Hybrid sidewall barrier facilitating low resistance interconnection

US Patent 11069566 · Granted Jul 20, 2021

Estimated economic value: $5,541,000 ⓘ

Assignee

IBM

Inventors

Oscar van der Straten (143 patents)
Koichi Motoyama (118 patents)
Joseph F. Maniscalco (30 patents)
Scott A. DeVries (4 patents)

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