Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Bonded body, power module substrate, method for manufacturing bonded body, and method for manufacturing power module substrate

Bonded body, power module substrate, method for manufacturing bonded body, and method for manufacturing power module substrate

US Patent 11062974 · Granted Jul 13, 2021

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Copper-ceramic bonded body, insulated circuit board, method for producing copper2025
Bonded body, power module substrate, power module, method for manufacturing bond2025
Bonded body, power module substrate, power module, method for manufacturing bond2025
Copper/ceramic bonded body, insulating circuit substrate, copper/ceramic bonded 2024
Copper/ceramic joined body and insulating circuit substrate2024
Insulated circuit board2024
Copper/ceramic bonded body, insulating circuit substrate, copper/ceramic bonded 2024
Bonded body, insulated circuit board with heat sink, and heat sink2024
Bonded body of copper and ceramic, insulating circuit substrate, bonded body of 2024
Copper/ceramic assembly, insulated circuit board, method for producing copper/ce2024
Method of manufacturing bonded body for insulation circuit substrate board and b2024
Copper/titanium/aluminum joint, insulating circuit substrate, insulating circuit2024