Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor package and method of fabricating semiconductor package

Semiconductor package and method of fabricating semiconductor package

US Patent 11031371 · Granted Jun 8, 2021

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Wind turbine blade with leeward reinforcement structures and windward reinforcem2025
Electrostatic discharge robustness for a single rail transmitting driver2025
Overlapping die stacks for NAND package architecture2025
Surface mount device bonded to an inner layer of a multi-layer substrate2025
Substrates for semiconductor packages, including hybrid substrates for decouplin2025
Semiconductor wafer and semiconductor dies formed therefrom including grooves al2025
Method of forming a semiconductor device including vertical contact fingers2024
Wire bond pad design for compact stacked-die package2024
Systems and methods for reducing the size of a semiconductor assembly2024
Integrated circuit wire bonded to a multi-layer substrate having an open area th2024
Overlapping die stacks for nand package architecture2024
Thermoelectric semiconductor device and method of making same2024