Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor structure having a conductive bump with a plurality of bump segments

Semiconductor structure having a conductive bump with a plurality of bump segments

US Patent 11018099 · Granted May 25, 2021

Estimated economic value: $13,899,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Wavelength conversion material and manufacturing method thereof, wavelength conv2025
Method of forming integrated circuit packages by bonding package component havin2025
Chip structure2025
Semiconductor device package having warpage control2025
Dynamic reservation of a charging station slot for a vehicle2025
Method for forming chip package structure2025
Vehicle warning system for actuating a mobile device to alert a vulnerable road 2025
Dicing method for stacked semiconductor devices2025
Wafer level package with polymer layer delamination prevention design and method2025
Package and printed circuit board attachment2025
Foot warmer2024
Bare-metal connection storage method and system, and apparatus2024