Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Electronic package structure with improved board level reliability

Electronic package structure with improved board level reliability

US Patent 11011455 · Granted May 18, 2021

Estimated economic value: $29,719,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor devices and methods of manufacturing semiconductor devices2025
Semiconductor devices and methods of manufacturing semiconductor devices2025
Electronic package structure with reduced vertical stress regions2024
Electronic package structure with reduced vertical stress regions2024
Electronic package structure with reduced vertical stress regions2024
Electronic package structure with reduced vertical stress regions2024
Semiconductor package having routable encapsulated conductive substrate and meth2024
Packaged electronic device having integrated antenna and locking structure2024
Semiconductor devices and methods of manufacturing semiconductor devices2024
Method of forming a molded substrate electronic package and structure2024
Land structure for semiconductor package and method therefor2024
Semiconductor devices and methods of manufacturing semiconductor devices2024