Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Unified events framework

Unified events framework

US Patent 10922151 · Granted Feb 16, 2021

Estimated economic value: $4,438,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method to form a via2013
3-D semiconductor die structure with containing feature and method2013
Method for forming interconnects for 3-D applications2011
Forming a 3-D semiconductor die structure with an intermetallic formation2011
Method to form a via2011
3-D semiconductor die structure with containing feature and method2010
Micropad formation for a semiconductor2010
Method for forming a through silicon via layout2010
Dual plasma treatment barrier film to reduce low-k damage2010
Semiconductor interconnect having adjacent reservoir for bonding and method for 2009
Micropad for bonding and a method therefor2009
Method of forming a semiconductor device having a diffusion barrier stack and st2008