Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Wafer level fan out semiconductor device and manufacturing method thereof

Wafer level fan out semiconductor device and manufacturing method thereof

US Patent 10903181 · Granted Jan 26, 2021

Estimated economic value: $26,710,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor device with redistribution layers formed utilizing dummy substrate2025
Semiconductor device using EMC wafer support system and fabricating method there2025
Semiconductor device with a porous air vent2025
Microrobot-based biomimetic system2025
Semiconductor chip including through electrode, and semiconductor package includ2025
Reduction coil for wireless charging and electromagnetic wave reduction apparatu2025
Rotor and sensorless control method for rotor2025
Image processing-based foreign substance detection method in wireless charging s2025
Semiconductor devices including substrates bonded to each other and methods for 2025
Processes for preparing (3R,4R)-1-benzyl-N,4-dimethylpiperidin-3-amine or a salt2025
Electronic device package and fabricating method thereof2025
Cryogenic austenitic high-manganese steel having excellent corrosion resistance,2025