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Home › Lower IC package structure for coupling with an upper IC package to form a package-on-package (PoP) assembly and PoP assembly including such a lower IC package structure

Lower IC package structure for coupling with an upper IC package to form a package-on-package (PoP) assembly and PoP assembly including such a lower IC package structure

US Patent 10879219 · Granted Dec 29, 2020

Estimated economic value: $24,597,000 ⓘ

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