CTE compensation for wafer-level and chip-scale packages and assemblies

Assignee

• Cubic

Inventors

• Kenneth Vanhille (15 patents)
• Aaron C. Caba (2 patents)
• Masud Beroz (77 patents)
• Jared W. Jordan (9 patents)
• Timothy Amis Smith (4 patents)
• Anatoliy O. Boryssenko (12 patents)
• Steven E. Huettner (10 patents)

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