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Home › Recessed interconnet line having a low-oxygen cap for facilitating a robust planarization process and protecting the interconnect line from downstream etch operations

Recessed interconnet line having a low-oxygen cap for facilitating a robust planarization process and protecting the interconnect line from downstream etch operations

US Patent 10832946 · Granted Nov 10, 2020

Estimated economic value: $848,000 ⓘ

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