Sensor package structure

Assignee

• Kingpak Technology

Inventors

• Sheng-Shu Yang (11 patents)
• LI-CHUN HUNG (26 patents)
• Hsiu-Wen Tu (35 patents)
• Jo-Wei Yang (8 patents)
• CHIEN-CHEN LEE (48 patents)
• Jian-Ru Chen (10 patents)

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