Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Integrated circuit substrate for containing liquid adhesive bleed-out

Integrated circuit substrate for containing liquid adhesive bleed-out

US Patent 10818567 · Granted Oct 27, 2020

Estimated economic value: $58,615,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Socket to support high performance multi-die ASICs2025
Socket to support high performance multi-die ASICs2025
Trans-inductor voltage regulator for high bandwidth power delivery2025
Backside integrated voltage regulator for integrated circuits2025
Backside integrated voltage regulator for integrated circuits2025
ASIC package with photonics and vertical power delivery2025
ASIC package with photonics and vertical power delivery2025
ASIC package with photonics and vertical power delivery2025
System, apparatus, and architecture for migrating an optical communication netwo2025
Integrated circuit package for high bandwidth memory2025
Integrated circuit package for high bandwidth memory2025
Structure for optimal XPU socket compression2025