Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Controlling warp in semiconductor laminated substrates with conductive material layout and orientation

Controlling warp in semiconductor laminated substrates with conductive material layout and orientation

US Patent 10790232 · Granted Sep 29, 2020

Estimated economic value: $6,035,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Warp mitigation using pattern-matched metal layers in organic substrates2023
Warp mitigation using pattern-matched metal layers in organic substrates2023
Server node connector mating condition health monitoring and reporting2023
Server node connector mating condition health monitoring and reporting2023
Pressure controllable encapsulated liquid thermal interface2023
Stress mitigation in organic laminates2022
Optimum warp in organic substrates2022
Optimum warp in organic substrates2022
Controlling warp in semiconductor laminated substrates with conductive material 2021
Controlling warp in semiconductor laminated substrates with conductive material 2021
Server node connnector mating condition health monitoring and reporting2020
Server node connnector mating condition health monitoring and reporting2020