Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Microelectronic modules with sinter-bonded heat dissipation structures and methods for the fabrication thereof

Microelectronic modules with sinter-bonded heat dissipation structures and methods for the fabrication thereof

US Patent 10785862 · Granted Sep 22, 2020

Estimated economic value: $18,901,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Methods of fabricating substrates with thermal vias and sinter-bonded thermal di2025
Power amplifier modules including topside cooling interfaces and methods for the2025
Power amplifier modules including topside cooling interfaces and methods for the2025
Power amplifier modules including topside cooling interfaces and methods for the2025
Amplifier modules with power transistor die and peripheral ground connections2025
Low-stress thermal interface2025
Power amplifier modules, systems, and substrates containing field trapper struct2025
Bias control circuit for power transistors2025
Multiple-stage Doherty power amplifiers implemented with multiple semiconductor 2025
Surface-mount amplifier devices2024
Surface-mount amplifier devices2024
Thick-silver layer interface2024