Micropillar-enabled thermal ground plane

Assignee

• University of Colorado, A Body Corporate

Inventors

• Ryan John Lewis (12 patents)
• Li-Anne Liew (4 patents)
• Ching-Yi Lin (33 patents)
• Collin Jennings Coolidge (5 patents)
• Shanshan Xu (33 patents)
• Ronggui Yang (26 patents)
• Yung-Cheng Lee (23 patents)

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