Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › FinFET with sloped surface at interface between isolation structures and manufacturing method thereof

FinFET with sloped surface at interface between isolation structures and manufacturing method thereof

US Patent 10727135 · Granted Jul 28, 2020

Estimated economic value: $7,842,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Mechanical wafer alignment detection for bonding process2025
Method for determining parameters of three dimensional nanostructure and apparat2025
Pre-cleaning for a deep trench isolation structure in a pixel sensor2025
Image sensor with diffusion barrier structure2025
Semiconductor devices and methods of manufacturing thereof2025
Package with tilted interface between device die and encapsulating material2025
Info structure with copper pillar having reversed profile2025
Semiconductor device and method of forming the same2025
Semiconductor device and method of forming the same2025
Semiconductor device and manufacturing method thereof2025
Integrated circuit structure and method with solid phase diffusion2025
Nanostructure and manufacturing method thereof2025