Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › MEMS component having a high integration density

MEMS component having a high integration density

US Patent 10680159 · Granted Jun 9, 2020

Estimated economic value: $13,502,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Laser system and method for the spectral broadening of pulsed laser radiation2025
Multiple layer system, method of manufacture and saw device formed on the multip2024
Optical arrangement for spectrally broadening laser pulses2023
Component with a thin-layer covering and method for its production2022
Electric component with sensitive component structures and method for producing 2022
Stacked modules2022
Relative phase measurement for coherent combining of laser beams2021
Multiplexer2021
MEMS component and method for encapsulating MEMS components2018
Method for producing a cased electrical component2018
Top-port MEMS microphone and method of manufacturing the same2018
BAW component and method for manufacturing a BAW component2018