Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Bondwire testing of IC using pin diode signatures

Bondwire testing of IC using pin diode signatures

US Patent 10670649 · Granted Jun 2, 2020

Estimated economic value: $33,342,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Reduced-impedance active current measurement2018
Reduced-impedance active current measurement2018
Reduced-impedance active current measurement2018
Defect detection in integrated circuit devices2015
Defect detection in integrated circuit devices2015
Output impedance compensation for linear voltage regulators2010
Semiconductor device having voltage output function trim circuitry and method fo2007
Virtual sensor based monitoring and fault detection/classification system and me1999