Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor package having an isolation wall to reduce electromagnetic coupling

Semiconductor package having an isolation wall to reduce electromagnetic coupling

US Patent 10630243 · Granted Apr 21, 2020

Estimated economic value: $7,280,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Circuit modules with encapsulant-embedded leadframe terminals, and methods of fa2025
Surface-mount amplifier devices2024
Radio frequency packages containing multilevel power substrates and associated f2024
Leadless power amplifier packages including topside termination interposer arran2024
Methods of fabricating leadless power amplifier packages including topside termi2023
Circuit modules with front-side interposer terminals and through-module thermal 2023
Integrated multiple-path power amplifier2022
Packaged dies with metal outer layers extending from die back sides toward die f2022
Leadless power amplifier packages including topside terminations and methods for2022
Packaged electronic devices with top terminations2022
Integrally-formed multiple-path power amplifier with on-die combining node struc2022
Digital step attenuator and method for operating a digital step attenuator2022