Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Substrate structure with selective surface finishes for flip chip assembly

Substrate structure with selective surface finishes for flip chip assembly

US Patent 10607960 · Granted Mar 31, 2020

Estimated economic value: $25,517,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Compartmentalized shielding of a module utilizing self-shielded sub-modules2025
Electronic device with solder interconnect and multiple material encapsulant2025
Method of fabricating contact pads for electronic substrates2023
Shielded electronic modules and methods of forming the same utilizing plating an2022
Electromagnetic shields for sub-modules2022
Segmented shielding using wirebonds2021
Electromagnetic shields for sub-modules2021
Process for molding a back side wafer singulation guide2021
Contact pads for electronic substrates and related methods2021
Double-sided module with electromagnetic shielding2021
Shielded electronic modules and methods of forming the same utilizing plating an2020
Using an interconnect bump to traverse through a passivation layer of a semicond2020