Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Microelectromechanical device and method for forming a microelectromechanical device having a support structure holding a lamella structure

Microelectromechanical device and method for forming a microelectromechanical device having a support structure holding a lamella structure

US Patent 10580663 · Granted Mar 3, 2020

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor component including an electronic component based on polycrystalli2025
Semiconductor die with pressure and acceleration sensor elements2025
Capacitive microelectromechanical device and method for forming a capacitive mic2025
Capacitive microelectromechanical device and method for forming a capacitive mic2025
Light emitter devices, optical filter structures and methods for forming light e2024
Light emitter devices, optical filter structures and methods for forming light e2024
Sensor system with a microelectromechanical sensor element and method for produc2024
Method of producing a semiconductor component and semiconductor component2024
Method of generating a germanium structure and optical device comprising a germa2023
Micromechanical sensor and methods for producing a micromechanical sensor and a 2022
Method for producing a moisture sensor at the wafer level and moisture sensor2022
Capacitive microelectromechanical device and method for forming a capacitive mic2022