{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Hybrid wafer dicing approach using a multiple pass laser scribing process and plasma etch process", "item": "https://www.patentleaderboard.com/patent/10535561"}]}

Home › Hybrid wafer dicing approach using a multiple pass laser scribing process and plasma etch process

Hybrid wafer dicing approach using a multiple pass laser scribing process and plasma etch process

US Patent 10535561 · Granted Jan 14, 2020

Estimated economic value: $50,821,000 ⓘ

Assignee

Applied Materials

Inventors

Jungrae Park (28 patents)
James S. Papanu (64 patents)
Ajay Kumar (385 patents)
Wei-Sheng Lei (107 patents)

View full patent text on Google Patents →