Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor package with partial plating on contact side surfaces

Semiconductor package with partial plating on contact side surfaces

US Patent 10515878 · Granted Dec 24, 2019

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor packages with integrated shielding2024
Semiconductor device and method of forming protective layer around cavity of sem2023
Stacked dies electrically connected to a package substrate by lead terminals2022
Cavity wall structure for semiconductor packaging2021
Semiconductor package with multiple molding routing layers and a method of manuf2020
Cavity wall structure for semiconductor packaging2020
Semiconductor package with a heat spreader and method of manufacturing thereof2020
Semiconductor package with plated metal shielding and a method thereof2020
Conductive shield for semiconductor package2020
Semiconductor package with multiple stacked leadframes and a method of manufactu2019
Semiconductor package with multiple molding routing layers and a method of manuf2019
Semiconductor package with multiple stacked leadframes and a method of manufactu2019