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Home › Bonding machines for bonding semiconductor elements, methods of operating bonding machines, and techniques for improving UPH on such bonding machines

Bonding machines for bonding semiconductor elements, methods of operating bonding machines, and techniques for improving UPH on such bonding machines

US Patent 10468373 · Granted Nov 5, 2019

Estimated economic value: $11,456,000 ⓘ

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