Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › High density semiconductor package and related methods

High density semiconductor package and related methods

US Patent 10468336 · Granted Nov 5, 2019

Estimated economic value: $10,895,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor device and package2023
Method of forming a semiconductor device2021
Package structure for semiconductor devices2021
Method of forming a multi-level thin film capacitor2016
Multi-level thin film capacitor on a ceramic substrate and method of manufacturi2014
Multi-level thin film capacitor on a ceramic substrate and method of manufacturi2013
Multi-level thin film capacitor on a ceramic substrate and method of manufacturi2011
Systems and methods for a tilted optical receiver assembly2009
Multi-level thin film capacitor on a ceramic substrate2007
Perimeter anchored thick film pad2003
Three dimensional packaging configuration for multi-chip module assembly2000