Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Power electronics package and method of manufacturing thereof

Power electronics package and method of manufacturing thereof

US Patent 10453786 · Granted Oct 22, 2019

Estimated economic value: $15,277,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Power distribution circuits for electrically powered aircraft2025
Electronic connection assembly2025
System and method for neuroactivity detection in infants2025
Power overlay module with thermal storage2025
Semiconductor device package and method of forming2024
Circuit board structure and method for manufacturing a circuit board structure2023
Ultra-thin embedded semiconductor device package and method of manufacturing the2023
Ultra-thin embedded semiconductor device package and method of manufacturing the2023
Power overlay module and method of assembling2023
High voltage semiconductor devices having improved electric field suppression2022
System and method for neuroactivity detection in infants2022
Systems and methods for shielded and adjustable medical monitoring devices2022