{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Method for integrated circuit manufacturing with directed self-assembly (DSA)", "item": "https://www.patentleaderboard.com/patent/10418245"}]}
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Home › Method for integrated circuit manufacturing with directed self-assembly (DSA)

Method for integrated circuit manufacturing with directed self-assembly (DSA)

US Patent 10418245 · Granted Sep 17, 2019

Estimated economic value: $15,951,000 ⓘ

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