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Home › Methods for forming a substrate structure for an electrical component and an apparatus for applying pressure to an electrically insulating laminate located on a core substrate

Methods for forming a substrate structure for an electrical component and an apparatus for applying pressure to an electrically insulating laminate located on a core substrate

US Patent 10384431 · Granted Aug 20, 2019

Estimated economic value: $17,708,000 ⓘ

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