Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Flat no-lead packages with electroplated edges

Flat no-lead packages with electroplated edges

US Patent 10366947 · Granted Jul 30, 2019

Estimated economic value: $25,816,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Point of load module and heatsink therefor2025
Point of load module and heatsink therefor2024
Printed circuit boards with plated blind slots for improved vertical electrical 2023
Exposed pad integrated circuit package2023
Exposed pad integrated circuit package2023
Exposed pad integrated circuit package2023
Printed circuit board layout2023
Piezoelectric sensor apparatus2022
Interposer printed circuit boards for power modules2022
Interposer printed circuit boards for power modules2022
Exposed pad integrated circuit package2021
Exposed pad integrated circuit package2021