Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor package device and method of manufacturing the same

Semiconductor package device and method of manufacturing the same

US Patent 10344383 · Granted Jul 9, 2019

Estimated economic value: $4,922,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Tablet stand2025
Semiconductor device package with conductive pillars and reinforcing and encapsu2025
Cell and tissue sheet forming package and cell injection equipment2025
Bending mechanism and surgical robotic arm including the same2025
Package structure, assembly structure and method for manufacturing the same2025
High electron mobility transistor2025
Blood pressure measurement devices and methods2024
Relay assembly with reverse connection protection2024
Generation of three dimensional geological model of geographic site2024
Semiconductor device package and the method of manufacturing the same2024
Step voltage identification for multiple inputs2024
Light-emitting device2024