Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Packaging a substrate with an LED into an interconnect structure only through top side landing pads on the substrate

Packaging a substrate with an LED into an interconnect structure only through top side landing pads on the substrate

US Patent 10325890 · Granted Jun 18, 2019

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Systems and methods for unifying formats and adaptively automating processing of2025
Light emitting diode constructions and methods for making the same2024
Methods of making light-emitting assemblies comprising an array of light-emittin2024
Method and apparatus for providing a passive color control scheme using blue and2024
Systems and methods for unifying formats and adaptively automating processing of2023
Pet water bottle2022
Packaging photon building blocks with top side connections and interconnect stru2022
Telephony terminal2022
Methods of making light-emitting assemblies comprising an array of light-emittin2022
Light emitting diode constructions and methods for making the same2022
LED package with surface textures and methods of formation2022
Telephony terminal2021