Durable bond pad structure for electrical connection to extreme environment microelectronic integrated circuits

Assignee

• NASA

Inventors

• David J. Spry (7 patents)
• Dorothy Lukco (6 patents)
• Philip G. Neudeck (21 patents)
• Unknown
• Liangyu Chen (1 patents)
• Roger D. Meredith (1 patents)
• Kelley M. Moses (1 patents)
• Charles A. Blaha (1 patents)
• Jose Gonzalez (8 patents)
• Glenn M. Beheim (2 patents)
• Kimala L. Laster (1 patents)

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