Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10256202 | Durable bond pad structure for electrical connection to extreme environment microelectronic integrated circuits | David J. Spry, Dorothy Lukco, Philip G. Neudeck, Carl Chang, Liangyu Chen +5 more | 2019-04-09 |
| 5146293 | Phase-stepping fiber-optic projected fringe system for surface topography measurements | Carolyn R. Mercer | 1992-09-08 |