Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10427215 | Punch unit and powder press molding device for manufacturing compacted powder pellet | Eiichi Kobayashi, Seiya Watanabe | 2019-10-01 |
| 5440985 | Delivery system for printing plate | Masatoshi Shimmura, Yasuo Shibuya | 1995-08-15 |
| 5403785 | Process of fabrication IC chip package from an IC chip carrier substrate and a leadframe and the IC chip package fabricated thereby | Hitoshi Arai, Syuichi Furuichi, Toshiyuki Yamaguchi, Takeshi Kanou, Muneo Yamada +2 more | 1995-04-04 |
| 4835598 | Wiring board | Tosiyuki Yamaguchi, Takeshi Kanou | 1989-05-30 |