Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12103277 | Shock absorbing laminate and display device | Tadatoshi Nakanishi, Kakeru Hanabusa, Motoi Kawamura | 2024-10-01 |
| 5403785 | Process of fabrication IC chip package from an IC chip carrier substrate and a leadframe and the IC chip package fabricated thereby | Hitoshi Arai, Syuichi Furuichi, Toshiyuki Yamaguchi, Takeshi Kanou, Tooru Higuchi +2 more | 1995-04-04 |