Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5403785 | Process of fabrication IC chip package from an IC chip carrier substrate and a leadframe and the IC chip package fabricated thereby | Hitoshi Arai, Toshiyuki Yamaguchi, Takeshi Kanou, Tooru Higuchi, Muneo Yamada +2 more | 1995-04-04 |