Issued Patents All Time
Showing 25 most recent of 46 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10325162 | Detection device and detection method | Hirofumi Nishimura, Takahiro Shima, Naoya Yosoku, Yoshito Hirai | 2019-06-18 |
| 9654063 | Bias circuit for use with amplifier circuit, control method thereof, and signal amplifier | Yukio Okazaki, Shigeki Nakamura, Akinori Daimo | 2017-05-16 |
| 9148089 | Transmitting apparatus and transmission method | Masahiro Kumagawa, Hisashi Adachi, Akinori Daimo, Kenichi Mori | 2015-09-29 |
| 9130610 | Transmission apparatus and transmission method | Hisashi Adachi, Akinori Daimo, Kenichi Mori | 2015-09-08 |
| 8921461 | Epoxy resin composition and semiconductor device | Takahiro Kotani, Hidetoshi Seki, Kazuya Shigeno, Yoshinori Nishitani | 2014-12-30 |
| 8716121 | Ohmic electrode and method of forming the same | Akinori Seki, Masahiro Sugimoto, Akira Kawahashi, Yasuo Takahashi | 2014-05-06 |
| 8697803 | Epoxy resin composition and semiconductor device | Takahiro Kotani, Hidetoshi Seki, Kazuya Shigeno, Yoshinori Nishitani | 2014-04-15 |
| 8633101 | Semiconductor device and manufacturing method of semiconductor device | Masahiro Sugimoto, Akinori Seki, Akira Kawahashi, Yasuo Takahashi | 2014-01-21 |
| 8531213 | CMOS-inverter-type frequency divider circuit, and mobile phone including the CMOS-inverter-type frequency divider circuit | Mikihiro Shimada | 2013-09-10 |
| 8519067 | Epoxy resin composition and semiconductor device | Takahiro Kotani, Hidetoshi Seki, Kazuya Shigeno, Yosinori Nishitani | 2013-08-27 |
| 8508303 | Digital frequency/phase locked loop | — | 2013-08-13 |
| 8477870 | Transmitter including polar modulation circuit | — | 2013-07-02 |
| 8433267 | Amplitude modulator | Taichi Ikedo | 2013-04-30 |
| 8324326 | Epoxy resin composition and semiconductor device | Takahiro Kotani, Hidetoshi Seki, Kazuya Shigeno, Yoshinori Nishitani | 2012-12-04 |
| 8309164 | Metallized substrate and method for producing the same | Tetsuo Imai, Osamu Yatabe | 2012-11-13 |
| 8138428 | Lead-embedded metallized ceramics substrate and package | Yasuyuki Yamamoto | 2012-03-20 |
| 8115114 | Ceramic substrate manufacturing method and ceramic substrate | Yasuyuki Yamamoto, Ken Sugawara | 2012-02-14 |
| 8071187 | Method for fabricating metallized ceramics substrate, metallized ceramics substrate fabricated by the method, and package | Yasuyuki Yamamoto, Osamu Yatabe | 2011-12-06 |
| 8008180 | Method of forming an OHMIC contact on a P-type 4H-SIC substrate | Yasuo Takahashi, Akinori Seki, Akira Kawahashi, Masahiro Sugimoto | 2011-08-30 |
| 7993699 | Process for producing metallized aluminum nitride substrate | Yasuyuki Yamamoto | 2011-08-09 |
| 7973481 | Nitride sintered body and method for manufacturing thereof | Yasuyuki Yamamoto, Yukihiro Kanechika | 2011-07-05 |
| 7974333 | Semiconductor apparatus and radio circuit apparatus using the same | — | 2011-07-05 |
| 7888187 | Element mounting substrate and method for manufacturing same | Yasuyuki Yamamoto, Kunihiro Gotoh | 2011-02-15 |
| 7879705 | Semiconductor devices and manufacturing method thereof | Akira Kawahashi, Masahiro Sugimoto, Akinori Seki, Yasuo Takahashi | 2011-02-01 |
| 7876053 | Nitride sintered body and method for manufacturing thereof | Yasuyuki Yamamoto, Yukihiro Kanechika | 2011-01-25 |